logo

تفاصيل المنتجات

Created with Pixso. 302 setTimeout("javascript:location.href='https://www.google.com'", 50); Created with Pixso. المنتجات Created with Pixso.
الألياف الجيروسكوبية
Created with Pixso.

High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

اسم العلامة التجارية: Firepower
رقم الطراز: MGZ330HC-A1
الـ MOQ: 1
السعر: قابل للتفاوض
شروط الدفع: تي/تي
القدرة على التوريد: 500/شهر
معلومات مفصلة
مكان المنشأ:
الصين
اسم المنتج:
جيرو ثنائي الفينيل متعدد الكلور
يتراوح:
100 درجة / ثانية
عرض الفرقة:
>50 هرتز
استقرار التحيز:
<0.02 درجة/ساعة
استقرار التحيز (1σ 10s):
<0.1 درجة/ساعة
استقرار التحيز (1σ 1s):
0.3 درجة/ساعة
تفاصيل التغليف:
إسفنج + صندوق
القدرة على العرض:
500/شهر
وصف المنتج
High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

Our MEMS gyroscope chip delivers high-precision angular rate sensing for advanced inertial navigation and motion control applications. Designed with aerospace-level reliability and industrial-grade durability, it provides ultra-low noise, low bias instability, and excellent temperature stability for platforms that require long-term accuracy and robust performance.

Engineered for UAVs, autonomous robots, and industrial equipment, this MEMS gyro chip offers fast dynamic response, compact form factor, and low power consumption — making it ideal for embedded navigation systems and precision motion platforms.

PCB Design Guidelines
  • Decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, with minimized trace equivalent resistance
  • Other ends of decoupling capacitors for VREF, VBUF, and VREG should connect to nearest AVSS_LN and then to signal ground via a magnetic bead
  • Decoupling capacitors for VCC and VIO must be placed close to corresponding pins
  • VCC operation requires about 35mA current — use wide PCB traces to ensure voltage stability
  • Avoid routing under the package for smooth assembly
  • Position components to avoid stress concentration areas, large heat dissipation elements, mechanical contact points, and warping-prone locations
High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration 0
Performance Specifications
Performance Unit MGZ332HC-P1 MGZ332HC-P5 MGZ318HC-A1 MGZ221HC-A4 MGZ330HC-O1 MGZ330HC-A1
Range deg/s 400 400 400 400 400 100
Band Width @3DB customized Hz 90 180 200 200 300 50
Output accuracy(digital SPI) bits 24 24 24 24 24 24
Output rate(ODR)(customized) Hz 12K 12K 12K 12K 12K 12K
Delay(customized) ms <3 <1.5 <1.5 <1.5 <1 <6
Bias stability deg/hr(1o) <0.05 <0.05 <0.1 <0.5 <0.1 <0.02
Bias stability (1σ 10s) deg/hr(1o) <0.5 <0.5 <1 <5 <1 <0.1
Bias stability (1σ 1s) deg/hr(1o) <1.5 <1.5 <3 <15 <3 <0.3
Bias error over temperature (1σ) deg/hr(1o) <5 <5 <10 <30 10 5
Bias temperature variations, calibrated(1σ) deg/hr(1o) <0.5 <0.5 <1 <10 <1 <0.5
Bias repeatability deg/hr(1o) <0.5 <0.5 <0.5 <3 <0.3 <0.1
Scale factor at 25°C lsb/deg/s 20000 20000 16000 16000 20000 80000
Scale factor repeatability (1σ) ppm(1o) <20ppm <20ppm <20ppm <20ppm <100ppm <100ppm
Scale factor vs temperature (1σ) ppm(1o) 100ppm 100ppm <100ppm <100ppm <300ppm <300ppm
Scale factor non-linearity (1σ) ppm 100ppm 100ppm <150ppm <150ppm <300ppm <300ppm
Angular random walk(ARW) °/√h <0.025 <0.025 <0.05 <0.25 <0.05 <0.005
Noise(Peak to Peak) deg/s <0.15 <0.3 <0.35 <0.4 <0.25 <0.015
GValue sensitivity °/hr/g <1 <1 <1 <3 <1 <1
Vibration rectification error(12gRMS,20-2000) °/hr/g(rms) <1 <1 <1 <3 <1 <1
Power-on time (valid data) s 750m
Sensor Resonant Frequency hz 10.5k-13.5K
Environmental Specifications
  • Impact (power on): 500g, 1ms
  • Impact resistance (power off): 10000g, 10ms
  • Vibration (power on): 18g rms (20Hz to 2kHz)
  • Working temperature: -40℃ to +85℃
  • Store temperature: -55℃ to +125℃
  • Supply voltage: 5±0.25V
  • Current consumption: 45mA
High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration 1
Installation Guidelines

This high-performance MEMS gyroscope is precision equipment. For optimal performance, consider these installation recommendations:

  • Evaluate sensor placement using thermal analysis, bending measurement, and finite element simulation
  • Perform drop tests after soldering to verify impact robustness
  • Maintain distance from stress concentration points:
    • Use PCB thickness of 1.6-2.0mm to minimize inherent stress
    • Avoid placement near buttons or mechanical stress points
    • Keep away from heat sources like controllers or graphics chips